
MediaTek has officially unveiled its latest mobile processors, the Dimensity 7400 and Dimensity 7400X.
These new chipsets build upon the success of their predecessors, the Dimensity 7300 and Dimensity 7300X, with enhanced artificial intelligence (AI) processing and gaming optimisations.
MediaTek Dimensity 7400, 7400X specifications
Manufactured using TSMC's 4nm process, both the chipsets feature an octa-core CPU, comprising four Cortex-A78 cores clocked at 2.6GHz and four Cortex-A55 cores at 2.0GHz. However, the Mali-G615 MC2 GPU promises efficient graphical performance for mobile gaming.
In terms of memory and storage, the processors support LPDDR5 and LPDDR4X, with speeds of up to 6400Mbps, as well as UFS 3.1 and UFS 2.2 storage. The connectivity options include 5G with 3CC carrier aggregation, Wi-Fi 6E, and Bluetooth 5.4.
The Imagiq 950 ISP enables support for up to 200MP cameras and 4K HDR video recording at 30fps. However, additional features such as AI-driven autofocus, video EIS, and hardware-based face detection enhance photography and videography capabilities.
That said, the primary difference between the Dimensity 7400 and Dimensity 7400X lies in their design focus. The Dimensity 7400X is specifically optimised for foldable devices, providing enhanced power management and efficiency for multi-screen use cases.
On the other hand, the Dimensity 7400 is suitable for regular smartphones, offering the same level of performance without the additional features required for foldable displays.
It's worth mentioning that the first smartphones powered by these processors are expected to debut in the first quarter of 2025.