Apple is highly anticipated to equip its iPhone 18 series with 2nm chipsets — A20 and A20 Pro — to provide its users with a powerful experience.
On Weibo, a tipster known as Mobile Phone Chip Expert claimed that next year's iPhone 18 series will be powered by a chip built using a 2nm process technology.
Moreover, Apple is reportedly gearing up to launch the next-generation iPhone as its first foldable device. The chip for the standard iPhone 18 will be the A20 chipset, named 'Borneo'. The company plans to offer 12GB RAM in the base model of the iPhone 18 series.
Meanwhile, Apple is expected to feature 'Borneo Ultra', which could also be marketed as A20 Pro, on its first iPhone Fold.
iPhone Fold features (expected)
The iPhone Fold will reportedly feature a minimal crease design and sport an LTPO+ flexible OLED display as it could unfold into a bigger display.
It could come with a new hinge technology — possibly using titanium or liquid metal — a side-mounted Touch ID sensor instead of Face ID.
Apple is currently expected to launch the iPhone Fold by September 2026. Moreover, the iPhone 18 series could also be released in the same year, comprising the standard iPhone 18, iPhone 18 Pro and iPhone 18 Pro Max.
Apple's current iPhone 17 series is powered by the A19 and A19 Pro chips, manufactured using TSMC's 3nm process.